Computer-on-modules (COMs) are designed to be used as
mezzanine cards, mounted on application specific baseboard.
Having compact size, low heat emission and wide range
of interfaces, computer-on-module gives embedded system designers an
opportunity to combine computer functionality and customer application
in the same board.
COMs usage allows to reduce system development time and
provides flexibility in choosing required functionality of embedded computer:
CPU speed, memory size, set of interfaces etc.
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PICMG COM Express Type II Module
based on Intel® Core® 2 Duo CPU
CPC1301
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CPC1301 is a PICMG COM Express Module based on Intel® Core® 2
Duo/Core Duo/Core Solo processor.
• Intel® Core® 2 Duo/Core Duo/Celeron CPUs
with 533/667 MHz FSB
• COM Express Type II pinout
• Up to 4 GB DDR2 dual channel memory
• CRT and LVDS
• Up to 5 x1 or 1 x4 and 1 x1 PCI-Express
• x16 PCI Express graphics interface
• Gigabit Ethernet port
• I2c bus
• Eight USB 2.0 ports
• Two Serial ATA, one IDE Ultra ATA/100 interface
• Extended temperature range
Datasheet
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ETX Computer-On-Module based on
AMD Geode™ LX800
CPB904
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CPB904 is a highly integrated ETX form-factor computer-on-module
based on low power AMD Geode™ LX800 CPU
• AMD Geode™ LX800 500 MHz (programmable)
• Soldered 256 MB DDR SDRAM
• 10/100 Base-T Fast Ethernet controller
• LCD and CRT displays support with 2D video accelerator
• Soldered Flash disk 64 MB
• Four USB 2.0 ports, three RS-232 ports
• EIDE: ATA-5 (UDMA66)
• Reserved BIOS
• Operating temperature: –40°C to +85°C
Datasheet
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"FemtoCore" module based
on Vortex86DX
CPB906
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Computer Module designed for use as a computing core in application
specific embedded systems.
• Vortex86DX processor 600 MHz
• 256 MB DDR2 SDRAM
• 10/100 Mbit/s Fast Ethernet
• 32-bit PCI, 8-bit ISA, LPC
• Two USB 2.0
• IDE interface (alternative 2×SDIO)
• Two RS-232, PS/2
• Eight digital I/O ports
• Industrial operating temperature range: –40°C to +85°C
Datasheet
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